Fkm and viton o rings temperature range.
Viton o ring temperature range.
Viton o rings offer excellent chemical and temperature resistance and are available in a wide variety of fkm types and formulations.
The working temperature range is considered to be 26 c to 205 230 c 15 f to 400 440 f.
Trp polymer solutions manufactures high performance perfluoroelastomer ffkm o rings for a wide range of applications.
O ring temperature ranges by o ring compound temperature guidelines for o rings and o ring compounds.
But for short working periods it will take even higher temperatures.
Depending on the grade the working temperature range is considered to be 26 c to 205 230 c 15 f to 400 440 f.
The temperature range of viton fkm fpm is considered to be between 20 c and 205 c depending on the grade.
Our high specification ffkm o rings are available to most standard sizes as 568a bs1806 bs iso 3601 1 bs iso 3601 2 and are supported by a large range of non standard tooling.
The name viton is a trademark a bit like hoover or sellotape and refers to fluorocarbon o rings or fkm fpm for short.
It can take even higher or lower temperatures such as 30 c 45 c and 230 c but for short working periods.
This material has an excellent tolerance for high temperatures resistance to oils fuels and hydraulic fluids as well as aromatics and solvents.
Standard as568 imperial metric and non standard viton o ring sizes are kept in stock and custom viton o rings are typically available with no tooling fees and rush deliviers.
Find o ring temperature ranges in the attached o rings temperature guide for o ring compounds and general elastomers including viton fluorosilicone nitrile silicone epdm kalrez neoprene and aflas materials.
Degrees in fahrenheit f degrees in celsius c polymer type 25 to 450 4 to 232 aflas 75 to 250 59 to 120.
Global o ring and seal offers an extensive selection of viton o rings x rings cord stock oil seals and more.
For further information regarding viton o rings visit our material properties page.
Actual temperature range of a compound in an end use application is highly dependent on part type hardware configuration applied.